CWB/18-60 Bonded semiconductor shaving tool

USE : CWB/18-60 tool enables the user to remove the bonded semiconductor while making a chamfer in a clean and swift manner on the transition.

SPECIFICATIONS :
Capacity : Ø 18 to 60 mm onto the semiconductor
Cutting depth : from 0.4 mm to 1.1 mm (1,8 mm max for CWB/18-60-FEP)
Chamfer angle : 8° (13° for CWB/18-60-FEP)
Remaining length of semiconductor : 25 / 30 / 40 mm

ADVANTAGES :
Removal of the bonded semiconductor without requiring lubricant.
Very smooth finish on the insulation.

CWB/18-60 = Max cutting depth (mm): 1.1 , Length (mm): 235 , Width (mm): 125 , Height (mm): 90 , Weight (g): 850
CWB/18-60-FEP = Max cutting depth (mm): 1.8 , Length (mm): 235 , Width (mm): 125 , Height (mm): 90 , Weight (g): 850

PENTA ESP (Electrical Safety Products)

We are PENTA 🚀 👷🏽‍♀️ Multinational industrial leader, pioneer and expert manufacturer of electrical safety solutions, committed to ensuring your safety at every intervention! 🤝 We are the essential partner for linemen, maintenance technicians and electricians working on power generation, transmission and distribution networks all over the world, and in 9 other areas of activity. With over 1200 employees in 18 subsidiaries worldwide, PENTA adapts its products to all electrical standards and regulations of each country. You will find our electrical safety solutions under different brands.

Share this product: