CWB/18-60 Bonded semiconductor shaving tool

USE : CWB/18-60 tool enables the user to remove the bonded semiconductor while making a chamfer in a clean and swift manner on the transition.

SPECIFICATIONS :
Capacity : Ø 18 to 60 mm onto the semiconductor
Cutting depth : from 0.4 mm to 1.1 mm (1,8 mm max for CWB/18-60-FEP)
Chamfer angle : 8° (13° for CWB/18-60-FEP)
Remaining length of semiconductor : 25 / 30 / 40 mm

ADVANTAGES :
Removal of the bonded semiconductor without requiring lubricant.
Very smooth finish on the insulation.

CWB/18-60 = Max cutting depth (mm): 1.1 , Length (mm): 235 , Width (mm): 125 , Height (mm): 90 , Weight (g): 850
CWB/18-60-FEP = Max cutting depth (mm): 1.8 , Length (mm): 235 , Width (mm): 125 , Height (mm): 90 , Weight (g): 850